The Qualcomm 845 will also be offering a 30% increase in the graphics performance. The new Kyro 385 design will be based on ARM cores and will be built on Samsung’s 2nd-gen 10nm process. The SoC will now come with an L3 cache with 2MB of memory along with a private L2 cache. As always the SoC will be manned by a set of high power and low power cores. The larger cores can be clocked up to 2.8GHz while the low powered ones up to 1.8GHz. On the imaging front, the new chip will come with a Spectra Image Signal processor and an updated Hexagon DSP for better performance in machine learning and also AI apps. The ISP also supports 480FPS slo-mo video capture with deep portrait mode and also support for other depth sensing technologies. Qualcomm has also worked on making the Snapdragon 845 more secure, and as a result, we get a dedicated “secure processing unit” which is alienated from the other hardware and is placed on an “island” within the chip. The purpose of the new chip will be to add a stronger layer of security for biometrics and key authentication without relying on the primary computing system. This shields the secure processing unit from brute attacks and other types of compromises. Connectivity features are extremely important on a new SoC, and the Snapdragon 845 seems to tick all the right boxes. The new X20 LTE modem will come with support for 5X carrier Aggregation which allows the maximum speed to reach up to 1.2GB which is a 20% improvement over its predecessor. The best part, however, is that the Snapdragon 845 will support dual LTE connection and we hope the manufacturers incorporate the same in their upcoming lineups. The WiFi 802.11ac is also touted to end up offering a 16x improvement in connection speeds and is likely to be 30% more efficient. The Bluetooth 5.0 will be offered with proprietary enhancements for better support to ultra-low power wireless earbud along with a feature to direct audio broadcast.
